Preparation of Property-Controlled Bi-Based Solder Powders by a Ball-Milling Process

Three kinds of Bi-based solder powders with different chemical compositions of binary Bi–Sn, ternary Bi–Sn–In, and quaternary Bi–Sn–In–Ga were prepared using a gas atomization process and subsequently ball-milled for smaller-size fabrication. In particular, only the quaternary Bi–Sn–In–Ga solder powders were severely broken to the size of less than 10 μm in a polyhedral shape due to the presence of the constitutional element, the degree of overall oxidation, and the formation of solid solution, which had affected the fractured extent of the Ga-containing solder powders. Furthermore, a melting point also decreased by the addition of In and/or Ga into the binary Bi–Sn solder system, resulting in a melting point of 60.3 ̋C for the Bi–Sn–In–Ga solder powders. Thus, it was possible that fractured Bi–Sn–In–Ga solder powders were appropriate for the adhesion of more compact solder bump arrays, enabling reflowing at the low temperature of 110 ̋C on a flexible polyethylene terephthalate (PET) substrate.